vinyl terminated

Physical Properties
 Form & Appearance: Colorless transparent liquid with good fluidity; free of mechanical impurities.
 Viscosity Range: 50–100,000 cSt (customizable), adaptable to processes like spraying, dipping, or potting.
 Density: 0.95–1.02 g/cm³ (25 °C), compatible with common organic solvents.
 Refractive Index: 1.40–1.42 (25 °C), comparable to glass for superior optical performance.
 Volatility: Low volatile content (≤0.5% after 150 °C × 24 h), minimizing processing losses.
 Surface Tension: 20–25 mN/m, ensuring excellent substrate wetting and adhesion.

Chemical Properties
 Reactivity: Contains vinyl groups (-CH=CH₂) for efficient crosslinking via addition reactions with Si-H bonds.
 Thermal Stability: Exceptional Si-O bond energy ensures long-term stability in -50–250 °C and short-term tolerance up to 300 °C (no decomposition).
 Weather Resistance: UV-resistant and oxidation-resistant, ideal for outdoor applications (e.g., LED encapsulation).
 Chemical Inertness: Resists 10% HCl/NaOH (168 h, no corrosion) and organic solvents (toluene, ethanol).
 Electrical Performance: Dielectric constant ≤3.0 (1 MHz), volume resistivity ≥10¹⁵ Ω·cm, delivering superior insulation.
 Eco-Compliance: Solvent-free; meets RoHS, REACH, and ISO 10993 biocompatibility certification.

Product Functions
 High-Transparency Encapsulation:
Light transmittance >90%, ideal for LEDs and optical sensors requiring exceptional clarity.
 Superior Electrical Insulation:
Volume resistivity ≥10¹⁵ Ω·cm, effectively preventing short circuits in electronic components.
 High-Temperature Protection:
Long-term stability from -50°C to 250°C, suitable for electronic encapsulation in extreme thermal environments.
 Low-Stress Performance:
Minimal curing shrinkage, reducing mechanical stress on precision electronics (e.g., MEMS, ICs).
 Weather & Moisture Resistance:
Water absorption rate <0.5%, ensuring reliability in humid or high-moisture applications.

Applications
 LED Encapsulation:
Boosts luminous efficiency and extends LED lifespan through high light transmittance (>92%) and thermal stability.
 Optoelectronic Displays:
Encapsulation and bonding for flexible OLEDs and touchscreens, ensuring durability and optical clarity.
 Semiconductor Packaging:
Protects semiconductor chips from moisture, stress, and thermal shock, enhancing reliability in harsh environments.
 Electronic Adhesives:
Secures PCB components and bonds sensitive electronics with low-stress curing and high dielectric strength.
 Photovoltaic Modules:
Improves weather resistance (QUV 3000h ΔE <1.5) and light transmittance (>91%) for solar panels, maximizing energy output.

Core Advantages
Advantages Technical Parameters Industry Value
Ultra-High Light Transmittance Light transmittance ≥92% (400–800 nm) Ensures high luminous efficiency for LEDs/optical devices and minimizes light loss.
Exceptional Electrical Insulation Volume resistivity ≥10¹⁵ Ω·cm
Dielectric constant ≤3.0 Prevents high-voltage breakdown, ensuring safe operation of electronic equipment.
High-Temperature Resistance Long-term stability: -50°C to 250°C
Short-term tolerance: 300°C Suitable for high-temperature electronics (e.g., automotive systems, power modules).
Low-Stress Encapsulation Curing shrinkage ≤1% Reduces stress on chip packaging, enhancing device reliability.
Eco-Safety Compliance RoHS/REACH compliant
Solvent-free Meets environmental regulations for electronics/optics; applicable in medical and food-contact scenarios.

Market Value
Electronics Applications & Market Value
 Encapsulation Materials (LEDs/Semiconductors)
Application: Protects LED chips and semiconductor devices, especially high-brightness LEDs (HB-LEDs), requiring UV and high-temperature resistance (>150°C).
Value:
Extends device lifespan and reliability, reducing lumen depreciation.
Global LED encapsulation materials market to exceed USD 2 billion by 2025, with vinyl silicone oil as a core material.
 Conductive/Thermal Adhesive Additives
Application: Base material for conductive silver adhesives or thermal greases in PCBs, 5G base stations, and consumer electronics cooling.
Value:
Enhances flexibility and adhesion, preventing cracks.
Global thermal interface materials market: ~USD 1.5 billion in 2023, growing at 8–10% CAGR.
 Insulating Coatings
Application: Moisture- and corrosion-resistant coatings for circuit boards and components.
Value:
Replaces traditional epoxy resins with superior -50°C to 250°C tolerance.
Global electronic protective coatings market: 7% CAGR, reaching USD 1.2 billion by 2025.
Optoelectronics Applications & Market Value
 Optical Device Bonding & Coatings
Application: Bonding and anti-reflective coatings for camera modules, optical sensors, AR/VR lenses.
Value:

90% light transmittance and refractive index 1.4–1.5 enhance optical performance.
Global optical adhesives market (e.g., OCA) to surpass USD 5 billion by 2025.
 Flexible Display Materials
Application: Substrate or encapsulation layer for flexible OLEDs, offering bendability and anti-aging.
Value:
Flexible display market growing >20% CAGR, projected to hit USD 40 billion by 2025 (DSCC data).
Overcomes limitations of traditional polyimide (PI).
 PV Module Encapsulation
Application: Encapsulants for solar panels, resistant to UV and environmental aging.
Value:
PV adhesive market to reach USD 800 million by 2025, with silicone-based materials capturing >30% share.
Market Drivers
 Technology Advancements: Surging demand for high-reliability materials from 5G, IoT, Mini/Micro LED.
 Localization: Reduced import dependence in China (e.g., Hoshine Silicon, Bluestar) lowers costs.
 Environmental Compliance: Solvent-free, low-VOC formulations meet EU REACH regulations.
Future Trends
 High-Performance Formulations: Development of UV-curable vinyl silicone oils for 3D-printed electronics.
 Integrated Solutions: Hybrids with nanomaterials (e.g., graphene) to enhance thermal/electrical conductivity.
Conclusion
Vinyl silicone oil’s market value lies in its irreplaceability across high-growth sectors:
Flexible displays, PV, LED encapsulation drive demand, with global market size projected to exceed USD 10 billion by 2025.
Opportunities in EVs, wearables, and AIoT will fuel growth, contingent on overcoming purity and cost bottlenecks to boost adoption.

Experimental Data & Case Studies
Experimental Data
Test Item Test Condition Result Benchmark
Light Transmittance Spectrophotometer (600 nm) 92% Conventional silicone: 85%
Volume Resistivity ASTM D257 1.5×10¹⁵ Ω·cm Epoxy resin: 10¹² Ω·cm
Damp Heat Resistance 85°C/85% RH, 1000 hours No delamination or yellowing Polyurethane: Failure at 500 hours
Thermal Conductivity Laser flash method 0.18 W/(m·K) Traditional materials: 0.1 W/(m·K)
Case Studies
 Mini LED Encapsulation
①　Issue: Conventional encapsulation materials yellowed, degrading display quality.
②　Solution: High-transparency vinyl silicone oil encapsulation.
③　Result: 15% increase in brightness; lifespan extended to 50,000 hours.
 Flexible OLED Screen Encapsulation
①　Requirement: Low-stress, high-flexibility materials for bendable displays.
②　Solution: Vinyl silicone oil-modified encapsulant.
③　Result: No cracks after 100,000 bends; >90% light transmittance maintained.
 Power Semiconductor Module Encapsulation
①　Challenge: High temperatures caused aging of traditional materials.
②　Solution: High-temperature-resistant vinyl silicone oil encapsulation.
③　Result: Stable operation at 200°C with 70% reduction in failure rate.

Preparation Process, Core Technologies & Precautions
Preparation Process
 Raw Material Preparation
①　Octamethylcyclotetrasiloxane (D4): Serves as the base material, providing the siloxane backbone.
②　Tetramethyldivinyldisiloxane (Vi-D4): Introduces vinyl functional groups, critical for silicone oil reactivity.
③　Catalysts:
Alkaline catalysts (e.g., KOH, TMAH) or organometallic catalysts (e.g., stannous octoate) to drive polymerization.
④　Inhibitors:
Alkyne alcohols to control reaction speed and prevent over-crosslinking.
 Reaction Steps
①　Ring-Opening Polymerization
Mix D4 and Vi-D4 in a reactor at 100–150°C.
Add catalyst to initiate polymerization.
D4’s siloxane bonds break, forming vinyl-modified polysiloxane chains.
Reaction time: 2–8 hours (adjusted for target molecular weight).
②　Equilibration Reaction
Add hexamethyldisiloxane (MM) as an end-capper to homogenize molecular weight distribution.
Extend reaction time to terminate chains and stabilize product.
③　Low-Boiler Removal
Heat to 150–200°C under vacuum (-0.09 to -0.1 MPa).
Remove unreacted monomers and low-MW byproducts via vacuum distillation.
④　Additive Blending
Incorporate additives based on application needs:
Antioxidants: Enhance thermal stability.
Surfactants: Improve wettability and dispersion.
Optimize additive types and ratios for specific uses (e.g., electronics, optics).
⑤　Filtration & Packaging
Filter through precision filters to remove impurities.
Package in airtight containers to prevent moisture/air exposure.
Core Technologies
 Molecular Structure Design
①　Side-Chain Vinyl Content Control:
Adjusts crosslink density (e.g., balances hardness/flexibility for LED encapsulation).
Typical range: 0.1–1.5% vinyl content.
②　Block/Gradient Copolymerization:
Incorporate phenyl or fluorinated groups to enhance refractive index (1.4–1.6) or solvent resistance.
 Functional Modification
①　UV-Curable Modification:
Introduce acryloyloxy or epoxy groups for photopolymerization (e.g., PCB protective coatings).
②　Nanocomposite Blending:
Add SiO₂/Al₂O₃ nanoparticles to boost mechanical strength and thermal conductivity (0.5–1.5 W/m·K).
 Electronics-Grade Adaptation
①　Low Dielectric Constant (2.5–3.0):
Achieved by reducing polar group content for high-frequency circuit materials.
②　High Light Transmittance (>95% @400–800 nm):
Critical for flexible OLED display encapsulation.
③　Anti-Yellowing Technology:
Hydrogenated silicone copolymers or UV stabilizers (e.g., hindered amine light stabilizers, HALS).
 Process Compatibility Optimization
①　Spin/Inkjet Coating:
Optimize viscosity (50–5000 cP) and surface tension (20–30 mN/m) for uniform deposition.
②　Low-Temperature Curing:
Enables <100°C curing for flexible electronics (prevents substrate damage).
Key Precautions
 Storage: Keep in light-proof, sealed containers below 25°C; shelf life: 6 months.
 Handling: Wear gloves and goggles; avoid skin contact.
 Equipment Compatibility: Avoid contact with sulfur/phosphorus-containing substances when using platinum catalysts.

Packaging & Ordering
Packaging: 200kg/1000kg plastic drums (customizable).